FiiO FT1 Pro Open-Back Planar Magnetic Wired Hi-Fi Headphones for Home, Studio, Recording, High Sensitivity (Black)

Price: $199.99
(as of Feb 25, 2025 08:06:17 UTC – Details)


95x86mm FIIO-developed planar driver | 1μm thin diaphragm Sapphire+Aluminum dual-coating technology Uniform magnetic field design | 28nm-grade process technology | 20Ω high-sensitivity design Open-backed design | 374g light weight | 12-level adjustable lightweight portable headband
95x86mm FiiO- Developed Flat Unit: The FT1 Pro unit measures 95x86mm, a size comparable to flagship heavy-duty flat earphones, yet it weighs only about 374g. Leveraging the advantages of the in-house developed flat unit, the T1 Pro delivers an exceptionally wide lateral soundstage rarely seen in its class, with almost imperceptible boundaries, effortlessly unlocking a full frequency response up to 40kHz.
1μm Ultra-Thin Diaphragm: After two years of independent research and development, the FiiO FT1 Pro features a leading 1μm ultra-thin diaphragm, made from PET high-performance substrate. In the microscopic world, even a difference of 2μm versus 1μm in diaphragm thickness leads to significant performance variations under high-speed vibrations, directly affecting the final sound quality.
Sapphire + Aluminum Dual-Coating Patent Technology: The diaphragm uses a dual-coating of sapphire and aluminum to enhance frequency response across different bands, improving audio resolution and allowing for a more detailed sound from the flat unit. The sapphire coating, known for its high hardness, effectively boosts high-frequency resolution, while the aluminum coating, lightweight in nature, improves the voice coil’s conductivity.
Uniform Magnetic Field Design: The magnetic field strength between adjacent magnets has been optimized to eliminate unevenness, further expanding the magnetic field range. When the flat diaphragm vibrates at high speeds, the FT1 Pro ensures uniform diaphragm amplitude, reducing segmented vibrations and distortion. This results in more refined sound performance, allowing for precise capture of the subtle nuances in the music.
28-Nanometer Chip-Level Manufacturing Process: This process, derived from semiconductor industry coating technologies, forms the necessary coating thickness for acoustics and significantly strengthens the durability and lifespan of the conductive coils. Each diaphragm undergoes this process twice to meet the dual-coating diaphragm design, delivering superior sound quality beyond its class.